| File |
Size (Bytes) |
Description |
| Work Package 1: Reference Design |
 D/M1.1.1
|
851.453
|
System Specification for the Gen1 demonstrator
|
|
D1.5.1b
|
332.542
|
Update Application Portfolio
|
|
D1.6.1b
|
312.149
|
Update Cost Assessment
|
|
D1.7.1a
|
1.414.689
|
Standardization Report
|
|
D1.7.1b
|
215.921
|
Standardization Report Update
|
|
D1.7.1c
|
819.360
|
Standardization Report Update
|
| Work Package 2: Manufacturing & Processing |
|
D2.2.2
|
233.240
|
Fabrication of TFT logic circuitry to be used on first
RF ID tag demonstrators
|
|
D2.2.7 & D2.5.2
|
269.240
|
D2.2.7: In-line fabrication process for sensor and memory elements
D2.5.2: TFT circuits integrated with sensor and memory elements
|
Work Package 3: Materials, Devices & Circuits |
|
D3.1.5
|
164.503
|
Testing and Aging Protocols toTest Active Lifetime of
PolyApply Devices and Define Acceleration Protocol
|
|
D3.1.8
|
192.537
|
Develop Formulations of Novel Stable OSC's and Dielectric
10^-1 cm^2 V^-1 s^-1 with Mobility 10 cm V s and Active Lifetimes at the Targets Determined by PolyApply
|
|
Milestone MSensor1
|
80.408
|
Results of materials screening and selection of sensor materials
|
Work Package 4: Reliability |
|
D4.1.1
|
230.250
|
Description of mask set for reliability testing
|
|
D/M4.1.2
|
1.449.014
|
Analysis of first sample generation from work package 3.2
Suggestion of a first material choice for reliable device
manufacturing
|
Work Package 5: Recycling and life cycle |
|
M5.1
|
1.016.313
|
Description of Analysis Methods
|
|
D5.1.1
|
1.252.577
|
Analysis Methods and First Results of Si-based Transponders
|
| Work Package 6: Accompanying Measures |
|
D6.14
|
117.566
|
Technical Roadmap: Phase 2
|
|
D6.15a
|
678.539
|
Benchmarking report
|
|
D6.15b
|
234.067
|
Benchmarking of Relevant International Activities
|
|
D6.6
|
1.025.881
|
Organic Electronics: Technical Roadmapping: Phase 1
|
