|
|
 |
Upcoming Events
|
19th Annual Thermal Printing Conference
|
19.05.2008
|
|
This years' conference departs from the traditional agenda by including a number of speakers from emerging technologies and capabilities that impact future thermal printing usage trends. Topics include:
* Camera phones and PDA's as application platforms and bar code readers
* Wireless communications trends that will advance mobile printing
* RFID chips and fabrications for smart labels
* Item level RFID tracking and printable electronics
* New added value thermal media trends in color, photos and security
* Application trends that impact ID cards and document security
* Impact of new capabilities in ink jet and electrophotography
As a mature technology, thermal printheads and media are highly refined, distribution channels are well established and thermal printing continues to dominate its primary markets. Given its maturity where can the thermal industry derive new and continued growth? This years' conference is designed to provide in depth insight to this and other strategic questions by exploring the new capabilities and innovations listed above.
|
|
|
Polymer Processing Society 24th Annual Meeting
|
15.06.2008
|
|
The Polymer Processing Society was founded in March 1985 at the University of Akron, Ohio, USA; the intent was to provide a mechanism and format for interaction and presentation of research results in the international polymer processing community; the goals are to foster scientific understanding and technical innovation in polymer processing by providing a discussion forum for the worldwide community of Engineers and Scientists in the field. The thematic range encompasses all formulation, conversion and shaping operations applied to polymeric system in the transformation from their monomeric forms to commercial products. Membership in PPS is open to all researchers in the field, and to all persons who feel the activities of the society advance their professional development.
|
|
|
International Symposium on Flexible Organic Electronics
|
10.07.2008
|
|
The purpose of IS-FOE is to bring together scientists and engineers actively engaged in the research, development, and manufacturing
for Flexible Organic Electronics including organic/inorganic materials, flexible substrates, manufacturing processes, circuit designs,
flexible devices, system integrations and product applications, and to discuss current progresses in this emerging field.
The IS-FOE will provide access to a variety of contents including organic electronic printable materials, device structures, system
integrations, manufacturing processes, product applications and business opportunities.
|
|
|
Polytronic '08
|
17.08.2008
|
|
Please join researchers, engineers and scientists from around the world to share knowledge and experience in Polymeric Materials for Microelectronic & Photonic Applications (POLY), Adhesives in Electronics, and Polymeric Electronics Packaging (PEP). The program will include keynote, invited and contributed presentations, as well as panel discussions
|
|
|
Electronic Goes Green 2008+
|
08.09.2008
|
|
Electronics is a key sector to master the arising challenges. The EGG 2008+ is the platform to show and to discuss how the electronics industry itself adapts to the changing world situation and how it contributes to master the challenges towards sustainable development. The Conference will also host the 1st World ReUse Forum on 7 September 2007.
The EGG 2008+ offers you the place where you show your contributions. We would like to invite you to submit a paper to our conference and to attend this biggest event on electronics and environment. We listed topics which we believe to fill this slogan with substantial contents in the Call for Papers. In case you would like to address another topic, you are welcome. Contribute to the success of this conference and to the future trends and solutions towards sustainable development. Please find the Call for Papers and Instructions for authors on our website http://egg2008.izm.fraunhofer.de and submit your abstract for a paper or a poster until 29 February 2008 latest. Please spread this Call to others who might also want to contribute. The full papers will be due on 31 May 2008.
|
|
