PolyScene can be considered as a predecessor project to
PolyApply .
The application scenarios and market drivers, developed within
this project, gave an answer to the following unsolved problems:
- The polymeric elements are up to now not suitable for production
because of the not optimised materials and fabrication techniques. The reproducibility
of production is not yet solved.
- The development currently still concentrates very much on
the optimisation of the single elements. For the development of systems, a
design environment including simulation possibilities is however urgently
required.
- For production of efficient and marketable products, the integration
of important elements (NMOS, bipolar transistors) has not yet been carried
out.
- The materials for the packaging of the polytronic elements
are not fully identified and developed, in particular from the system viewpoint.
A specific new and further development of passivating moulding and connection
technologies, based to hybrid materials, should positively affect the costs
of systems and their long-term stability.
- A fabrication technique which prints circuits for ultra-low-cost
applications in a roll-to-roll process also on flexible substrates does not
exist up to now.
At present there is much knowledge about polytronics already available. PolyScene
aimed to filter and to channel this knowledge. The project work resulted in
a number of reports which are available from the
PolyScene documents folder.
Members of the PolyScene network:
FHG-IZM,
Germany
Acreo AB, Sweden
IMEC, Belgium
Infineon Technologies AG,
Germany
CEA-LETI, France
Motorola GmbH, Germany
Philips Electronics, Netherlands
Siemens AG, Germany
STMicroelectronics, France
THOMSON multimedia
R&D, France
VDI/VDE-IT GmbH, Germany
Avecia Group PLC
